Athos Silicon | The Foundation of Safe Autonomy

Quarterly Updates - October 2025

Welcome to the Inaugural Athos Silicon Newsletter!

It's been an exciting summer at Athos, with several key milestones reached on our path to develop the first functionally safe chiplet-based compute platform for real-time autonomy in robotics, automotive, and avionics. Since the company's inception in March of this year, our founders have been working tirelessly to refine Athos' multiple-Systems-on-Chip (mSoC™) architecture and ecosystem. This mSoC approach will enable modular scaling of compute resources while delivering safety, determinism, and power efficiency needed for the future of autonomy. With over 30 patents and decades of experience at Mercedes-Benz prior to Athos, our founders are ready for the challenge ahead.

The Athos Silicon Vision

Think of Athos as making a powerful computer out of interlocking building blocks. Traditionally, companies build one big, complex chip, but if one part fails, the entire system is compromised. We design chips in smaller pieces called chiplets that fit together. This process combined with Athos' patented technology, makes computers safer, more reliable, and scalable. Polaris is our first product, aimed at the kind of high-performance computing needed for self-driving cars, robotics, and aerospace systems where safety is critical.

First Test Vehicle Hits the Road

In June, Athos took delivery of our first test vehicle, a Mercedes-Benz S-Class equipped with a complete Level 4 sensor suite, including LiDAR, radar, and camera systems. This enables live testing and integration in real-world autonomy scenarios. Founder and CTO Francois Piednoel has been hands-on (no hands on the wheel though!) putting it through its paces.

Athos Silicon CEO Charnjiv Bangar said, “Testing with real-world sensor loads is where it counts. This vehicle provides us with the platform to bring up mSoC under true Level 4 conditions, with the bandwidth, compute, and safety-critical constraints that actually define full autonomy.”

Key Architecture Milestone - DreamBig Chiplet Hub™ Announcement

In July, Athos announced a partnership with DreamBig as a key technology component of our first-generation product, Polaris. Athos Silicon's mSoC architecture empowers developers and system architects to tame today's unmanageably complex software stacks by transforming them into deterministic hardware architectures designed for safety certification, energy efficiency, and exceptional performance. At the center of the architecture is DreamBig's breakthrough chiplet, which delivers a generational leap in memory bandwidth and latency performance.

Steve Majors, SVP of Engineering at DreamBig said, “The Chiplet Hub provides safety and integrates 3D high bandwidth memory (HBM) on top of a high-performance fabric base die, giving users centralized control of shared hardware resources across attached chiplets, a perfect fit for the mSoC vision.”

Mercedes-Benz Announcement and “The Road Ahead...”

Capping off an exciting summer, in late September Mercedes-Benz officially announced their reference design collaboration and significant investment in Athos, a vital step in delivering Athos Silicon's vision.

What began as breakthrough chiplet research inside Mercedes-Benz R&D has now evolved into Athos Silicon's mSoC platform, delivering modular performance scaling, faster innovation cycles, and safety-by-design principles for next-generation autonomous systems.

By spinning off this technology in Athos Silicon, we can more efficiently extend mSoC beyond automotive into broader autonomy applications like robotics, drones and aerospace. This benefits the overall autonomy industry and Athos Silicon is grateful to Mercedes-Benz for having recognized that and helping to bring this vision to life.

“Mercedes-Benz continuously explores technologies that can advance safety, performance and automated driving. Open chiplet approaches—such as UCIe—show promise for future high-performance compute architectures. Athos Silicon, an independent company with roots in research initiated at Mercedes-Benz in 2020, will pursue its own path to develop these ideas for broader industry use.”

— Markus Schäfer, Member of the Board of Management of Mercedes-Benz Group AG, Chief Technology Officer

Read the Reuters coverage featuring an interview with Athos Silicon CEO Charnjiv Bangar.

Athos Silicon on the Conference Circuit - EE Times and IEEE Keynotes

On August 4, 2025, Francois Piednoel delivered the EE Times | The Future of Chiplets 2025 keynote, "Design and Assembly of an Automotive-Grade Chiplet-Based Multiple Systems-on-Chip", during an event examining how multi-die (chiplet) architectures, emerging standards, and 2D/3D integration accelerate high-performance, energy-efficient compute for the AI era.

Watch the EE Times Keynote

On September 8, 2025, Francois presented at the IEEE World Technology Summit in Berlin, whose “Digital Automotive Technologies” theme brought together leaders to explore how AI, autonomy, software, and advanced electronics are reshaping the automotive industry.

Learn More About the IEEE WTS Keynote

See You Next Quarter!

We hope these updates keep you connected. Exciting developments ahead!

Press and Analyst Inquiries: press@athossilicon.com

General Inquiries: info@athossilicon.com

Investor Relations: ir@athossilicon.com

— The Athos Team